PCB hpe dip na matu laksan foam silicone gaskets: -madang tsaw ai arung arai ni a matu hkum tsup ai jep joi ai lam
PCB, FPC, hte HDI multilayer board ni a matu hot pressing galaw ai ladat ni hta, foam silicone gaskets ni gaw board hpe shingdaw ai lam, ntsa lam n-gun n rawng ai lam, n-gun rawng ai lam (sh) n-gun n rawng ai lam (copper foil oxidation) hpe makawp maga ya ai ahkyak ai karum shingtau ai arung arai ni hku nna magam gun nga ai. Sut masa hku nna lang mai ai foam arung arai ni rai nga ai, shinggyim masha ni lang ai foam sponge, PVC foam, shing nrai, n kaja ai silicone foam ni gaw PCB hpe loi loi hte n-gun n rawng hkra galaw ya lu ai, adhesive hpe lwi shangun lu ai, ntsa lam hpe awu asin byin shangun ai, board hpe n-gun n rawng hkra galaw ya lu ai. Mari ai ni hte galaw shapraw ai ni law law gaw, -quality kaja ai hte n kaja ai arung arai ni hpe garan ginhka chye na matu yak hkak nga ai. Tengman ai-mungkan PCB matut mahkai masa ni hpe madung tawn nna, ndai laika buk gaw, n-gun n rawng ai arung arai ni hte, n kaja ai arung arai ni kaw na, n-gun ja ai PCB foam silicone gaskets ni a matu, shadawn shadang, shadawn shadang, tatut galaw mai ai jep joi ai lam ni hpe gawgap da ai.
I. Npawt nhpang sawn la ai lam ni: PCB bungli galaw ai masa hta htuk manu ai Core Materials ni a matu ra kadawn ai lam kaji dik htum
Hpa majaw nga yang, n-gun ja ai PCB foam silicone gaskets ni gaw, shinggyim masha ni lang ai -grade (sh) shinggyin la ai -grade foam arung arai ni hte npawt nhpang hku nna shai ai; shanhte a arung arai ni gaw PCB lang ai hta nhprang arai-n lawm ai, n-gun ja ai-hkum hkrang n-gun kaba hte matut mahkai na matu grai sawng ai ra kadawn ai lam ni hpe hkan sa ra ai – ndai gaw manu dan ai arung arai ni hpe chye ginhka lu na matu madung masat masa rai nga ai.
1. N san seng ai n-gun n lawm ai san seng ai silicone n-gun: PVC, EVA, bai jai lang ai silicone n-gun, shing nrai, grai law ai calcium carbonate n-gun rawng ai n kaja ai arung arai ni hpe ningdang kau ai; 100% n-gun ja ai-n-gun ja ai vulcanization foam molding hku nna galaw shapraw ai, n-gun ja ai shara hta n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai san seng ai hte ngang grin ai arung arai hpe lu la hkra galaw ya ai.
2. Sulfur-n lawm ai, halogen-n lawm ai, n-gun n law ai, n-gun n rawng ai: PCB bonding core ni a matu madung pat shingdang ai lam ni gaw sulfur hte n kaja ai n-gun rawng ai arung arai ni nga ai. Hpa majaw nga yang, n-gun ja ai gaskets ni gaw, sulfur-n lawm ai formulation hpe ngang ngang kang kang hkan sa nna, RoHS hte halogen-n lawm ai grup yin masat masa ni hpe hkan sa ai, n-gun ja ai nbung hte n-gun ja ai masa hta n-gun ja ai arung arai ni hpe n shapraw ai-hpyen n-gun n-rawng ai hpe atsawm sha pat shingdang lu ai. Ndai gaskets ni gaw, hkrak tup hkrak re ai HDI board, FPC n-gun rawng ai board, n-gun nnan BMS circuit board ni hpe galaw shapraw na matu htuk manu ai.
3. Nbung laru kaba hta ngang grin ai bungli galaw lu ai: -50℃kaw nna 250℃du hkra nbung laru shingjawng ai makau grup yin hta aten galu ngang grin ai hku bungli galaw lu ai, 180–0 degree,w2 hta n-gun ja ai PCB vacuum heat pressing galaw ai lam ni hpe ninghkap lu ai. aten kadun-peak temperature aten hta manam pyaw ai baw pru wa ai majaw, n-gun kaba ai matut manoi galaw shapraw na matu htuk manu ai.
II. Hkrang nsam hte hkrang masa: Myi hte mu lu ai atsam marai (madung jep chyoi ai masat masa)
Hpa majaw nga yang, n-gun ja ai foam silicone gaskets ni hpe laksan jak n lang ai sha, nsam, n-gun n-gun, ntsa lam n-gun n-rawng ai hpe madung tawn nna shawng lata la mai ai; dai lam ni gaw, galaw shapraw ai lam a hkrak ai lam hpe hkrak madun dan ai.
1. Grai bung ai n-gun: Board n-gun yawng hpe ±0.1 mm laman hta hkang lu ai, n-gun n bung ai lam (sh) shara shagu n bung ai lam n nga ai. PCB hpe dip ai gaw, n-gun hpe maren mara garan gachyan na matu washer ni hpe kam hpa ai; n-gun kaba ai galai shai ai lam ni gaw, n bung ai npu na n-gun hpe hkrak sha shabyin ya lu nna, shara langai ngai hta n-gun n rawng ai, n-gun n rawng ai, delamination, shing nrai, n-gun n rawng ai zawn re ai n kaja ai lam ni hpe byin shangun chye ai.
2. N bung ai hte n-gun rawng ai hku garan nga ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai: Kata na n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai, grai kaba ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai layers ni n nga ai. Elastic bungli galaw lu na matu hte pressure rap ra hkra galaw na matu, uniform pores ni gaw ra kadawn nga ai; n kaja ai pores ni gaw n tara ai hku garan ginhka ai lam, n bung ai hku n-gun dat ai npu hta bai nhtang wa ai lam, n-gun dat ai lam hta grai n kaja ai lam ni hpe madun dan ai.
3. Ntsa gaw n-gun n rawng ai, n-gun n rawng ai, n san seng ai, n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai jut ni hpe atsawm sha htu da ra ai. PCB bungli galaw ai shara gaw san seng ai galaw shapraw ai makau grup yin hta bungli galaw ai; npu na gaskets ni gaw powder (sh) chips ni hpe shapraw kau ya lu nna, ntsa kaw na n san seng ai arung arai ni gaw circuit board hpe hkrak hkrak hkan nang ai majaw, short circuit (sh) ntsa kaw na n kaja ai lam ni byin chye ai.
4. Color fading or migration n nga ai uniform coloration: Nsam yawng gaw n galai shai ai sha nga ai, nbung katsi ai hte n-gun ja ai masa hta nsam n htum ai (sh) nsam pru ai lam n nga ai hpe madun dan ai, PCB ntsa (sh) pre-cured film hpe awu asin di kau lu ai nsam htawt sit ai lam hpe atsawm sha pat shingdang lu ai.
III. Core Physical Properties: PCB hpe matut mahkai na matu ahkyak dik htum ai bungli galaw ai lam masat masa ni (madung jep joi ai lam)
PCB hpe n-gun dat ai gaw, n-gun ja ai, ngang kang ai, n-gun dat ai lam ni hpe grai ngang kang ai hku ra sharawng ai lam ni hpe galaw ya ai. Specification yawng hpe mass galaw shapraw ai masa ni a matu kaja dik htum galaw da ai.
1. Kaja dik htum ngang kang ai lam hte hkrak tup ai n-gun: High-quality gaskets ni gaw A5–30 ngu ai Shore ngang kang ai lam hpe ngang grin hkra galaw ya ai majaw, PCB board amyu myu hpe hkrak hkrak hkan sa lu ai. Rigid board ni a matu grau ngang kang ai hpe lata nna, n-gun grau ja hkra galaw na matu, flexible printed circuits (FPCs) ni a matu grau n-gun ja ai hpe lata ai. Ndai balanced hardness profile gaw grai n-gun ja ai majaw board ntsa hpe hkra machyi shangun ai (sh) grai n-gun ja ai arung arai ni a majaw n-gun n rawng ai hpe pat shingdang ya ai.
2. Hkam la mai ai n-gun hte rap ra ai n-gun: Standard n-gun 0.35–0.9 g/cm3 rai nna, n-gun langai sha rai nna, shara shagu hta n bung ai lam n nga ai. Density n law ai gaw cushioning hte shock hpe hkam sharang lu ai atsam hpe madi shadaw ya ai, density kaba ai gaw structure stability hpe jat ya ai majaw PCB high-pressure lamination application ni a matu hkum tsup ai hku htuk manu ai. Compression ratio hpe 5%–15% ngu ai hpaga lam-ningbaw ningla ginra kata hta tut nawng tawn da ai.
3. Ultra-hkum tsup ai hkam sharang ai lam hte n-gun n law ai prat tup n-gun shayawm ai lam: 100 jan n-gun shayawm ai lam hte n-gun shayawm ai lam hpe 100 lang galaw ngut ai hpang, bai hkam kaja wa ai lam gaw 95% hta grau kaba ai (sh) maren sha rai nga ai, hkrat sum ai lam n byin ai, elastic atla, n-gun shayawm ai lam n nga ai. Hpa majaw nga yang, n kaja ai arung arai ni gaw, n-gun n rawng ai arung arai ni hpe, bai nhtang shinggrup ngut ai hpang, prat tup hkrat sum mat ai hte, n-gun n bung ai hpe madun dan ai majaw, batch-wide PCB n kaja ai lam ni byin pru wa ai, rai tim, high-quality gaskets ni gaw, aten galu - cyclic lang ai hpe hkam sharang lu nna, grai jat wa ai service prat hpe hkam sharang lu ai.
4. Tackiness-hkam sharang lu ai hte high-n-gun ja ai tensile performance: Grai kaja ai yawng hkra ngang kang ai lam hpe madun dan ai, garan ginhka ai, si ai-hten ai, shing nrai, n-gun ja ai -hkum hkrang n-gun hpe bai kahtap galaw ai shaloi, n-gun n law ai hpe madun dan ai. Automated galaw shapraw ai line ni hta -frequency law law lang na matu kaja dik htum rai nna, jai lang mai ai galai shai ai frequency hte n-gun yawm ai aten sum ai lam ni hpe shayawm ya lu ai.
IV. Katsi katsang hpe ninghkap lu ai atsam hte bungli galaw ai hta ngang grin ai lam: Mass Production ngang grin ai lam a matu madung masat masa ni
PCB galaw shapraw ai ni gaw, ngang grin ai mass production hpe ahkyak shatai nna, dai shara hta, spacer ni a n-gun yawm ai lam, asak kaba wa ai lam, n-gun shayawm ai lam ni gaw, manu jahpu hpe shayawm lu na matu hte, n-gun atsam hpe grau kaja hkra galaw lu na matu ahkyak ai, dai hta n-ga, -quality tsaw ai arung arai ni hpe jep joi na matu ahkyak ai masat masa ni mung rai nga ai.
1. Excellent high-temperature thermal stability: 200℃daram hta aten galu bai nhtang galaw ai thermal cycling npu hta, dai arai gaw n-gun shayawm ai, jat wa ai, n-gun shayawm ai, n-gun shayawm ai lam n nga ai, n-gun shayawm ai lam hta n-gun shayawm ai lam n nga ai sha, laklai ai dimensional stability hpe madun dan ai.
2. Kaja dik ai anti-aging, ozone hpe ninghkap lu ai, hte nbung laru hpe ninghkap lu ai: Sealed high-temperature makau grup yin hta aten galu bungli galaw ai npu hta, lawan ai hku n hkrat sum ai (sh) hkrat sum ai lam n nga ai, aten kadun hta byin wa chye ai manghkang ni rai nga ai, n-gun ja ai, n-gun n rawng ai, shing nrai, n-gun n rawng ai. mass galaw shapraw ai masa ni hpe n-gun jaw ai.
3. -n-hkap la ai, ngam ai-n-lawm ai, n-gun n-rawng ai: Pressing galaw ai shaloi, pre-cured sheet kaw na resin n-hkap la ai (sh) grau law ai resin n byin ai; npu gaw san seng ai hte jasan jaseng na matu loi ai, jat nna demolding tsi lajang ai lam n ra ai sha, panel ntsa na adhesive n san seng ai lam hpe pat shingdang ya nna, bai galaw ai lam hpe grai shayawm ya lu ai.
V. Process hte htuk manu ai lam hte laksan galaw lu ai atsam: High-End PCB galaw shapraw na matu ra kadawn ai lam ni
Ndai premium foam silicone gaskets ni gaw, PCB hpaga lam a matu laksan galaw da ai rai nna, laklai ai npawt nhpang bungli hpe jaw ya ai sha n-ga, hkrak tup galaw shapraw ai lam ni hta ra kadawn ai lam yawng hpe mung hkan sa ya lu ai.
1. Hkum tsup ai hkrang masa hpe shinggrup da ai: 1 kaw nna 50 mm du hkra hkum tsup ai hku gram lajang ai lam hpe madi shadaw ya ai, roll hkrang, hkum tsup ai sheet hkrang, die-cut custom hkrang ni, shing nrai adhesive-backed variants ni hta mai lang ai, PCB size hte vaquium amyu myu hte htuk manu ai.
2. Lata mai ai anti-static cleanroom hkrang: Anti-static grup yin ni hte ap nawng da ai nhprang wan -lawm ai bungli shara ni a matu laksan masat da ai lam ni, nhprang wan n-gun hpe n-gun n-gun n-gun n-nga hkra pat shingdang lu ai, n-gun n-rawng ai wan n-gun nnan ni hpe galaw shapraw na matu htuk manu ai, high{end electronic PCBs, ginwang board ni hpe lang ai.
3. Lamination galaw na matu board amyu myu hte htuk manu ai: FR4 ngang kang ai board ni, FPC n-gun ja ai board ni, HDI hkrak ai board ni, BMS battery board ni, hte multilayer composite board ni a matu lamination galaw ai lam ni hpe kam mai ai hku madi shadaw ya ai, grai kaja ai n-gun garan gachyan ai lam hte n-gun n-gun shayawm ai lam ni hpe jaw ya ai. delamination, n-gun n rawng ai, n bung ai n-gun rawng ai.
VI. Ga shadawn: PCB foam silicone a hkamja lam hpe ga si langai sha garan ginhka lu ai.
Substandard gaskets: sulfur n san seng ai hte n-gun n rawng ai arung arai ni hte kayau kaya galaw da ai; n bung ai n-gun, n bung ai pore structures, n kaja ai hkam sharang ai lam; n-gun ja ai shara ni hta board ni hta n-gun n rawng ai hte n-gun rawng ai, powder hpe ayan garan kau ai, aten kadun-lang ngut ai hpang law law lang kabai kau ai majaw PCB pru ai lam hpe grai shayawm ya lu ai.
Hpa majaw nga yang, n-gun ja ai PCB foam silicone gaskets: sulfur-n lawm ai hte n-gun n rawng ai, n-gun langai sha re ai, n-gun n rawng ai, hkang lu ai ngang kang ai hte n-gun rawng ai, n-gun n law ai n-gun rawng ai, 250℃thermal cycling hpe hkam sharang lu ai, san seng ai hte n-gun n rawng ai, n-gun n rawng ai. PCB amyu ni hpe thermal pressing hku nna – kam mai ai hku nna hkai lu hkai sha ai lam hpe jat ya lu ai hte galaw shapraw ai manu hpe shayawm ya lu ai industrial-grade laksan jai lang ai arung arai langai mi.