Hka lum ai hpe n-gun jaw ai, electronic n-gun hpe n-gun jaw ai, circuit board hpe n-gun jaw ai zawn re ai jai lang ai lam ni hta, wan n-gun hpe n-gun jaw lu ai atsam, wan n-gun hpe n-gun jaw lu ai atsam, wan hkru ai lam hpe shim lum ai lam ni gaw bungli galaw ai shara hta wan hkru na hkrit tsang hpa ni hte arung arai shapraw ai lam hpe hkrak dawdan ya nga ai. Gat kaw nga ai madung arung arai masum-EVA foam, EPDM foam, hte wan n-gun hpe n-hkap la lu ai silicone foam-wan n-gun hpe ninghkap lu ai atsam hta grai shai hkat nga ai. Lahta e, wan hkru ai lam, n-gun ja ai-temperature akyang lailen, wan hkut n-gun, hte jai lang mai ai bungli galaw ai masa ni hpe shingdaw nna, hkum tsup ai shingdaw ai lam hpe ka da ai.
一. EVA foam (madang manu n hkrat ai foam arung arai)
Native EVA gaw grai hkru ai arung arai rai nna, grai sawng ai oxygen index gaw 17–19 sha rai nga ai; n galai shai ai nsam ni gaw UL94 HB wan hkru ai masat masa hpe hkan sa ai. Dai gaw hpaw da ai wan n-ga ni hte hkrum katut ai shaloi matut manoi wan hkru nna, grup yin na panel ni hte arung arai ni hpe wan hkru shangun lu ai hka htung ni hku nna lwi mat wa nna, wan hkru ai shaloi wan n-gun law law hte n hkru n kaja ai n-gun dat ni hpe shapraw kau ya ai.
degree jan ai nbung katsi ai shara ni hta aten galu hkam sha ai npu hta, wan n-gun shayawm ai EVA hpe shapraw na matu wan n-gun shayawm ai tsi ni hpe jat bang ai shaloi pyi, V-1/V-0 rating hpe aten kadun laman sha lu la nna, ahkyak ai hkra machyi lam ni nga ai: 80℃jan ai nbung katsi ai shara ni hta aten galu hkam sha ai npu hta, kata na wan n-gun shayawm ai filler rapmeid of grameid, lang hte lang katsi ai hpang; 120℃jan ai nbung laru hta, dai arai gaw n-gun yawm mat nna, n-gun yawm mat ai majaw, PCB nbung n-gun ja ai jak ni (200℃jan) a matut manoi nbung n-gun kaba ai bungli galaw ai masa ni a matu tsep kawp n htap htuk mat ai.
Akyu langai sha gaw manu n law ai; shi gaw grup yin-katsi ai shara hta shinggyin tawn na matu hte n-gun n law ai -katsi ai shara hta tawn da na matu sha htuk manu ai, n-gun ja ai-katsi ai galaw shapraw ai line ni hta lang na matu mung grai pat hkum da ai.
2. EPDM (Ethylene Propylene Diene Monomer) n-gup magap (HVAC hpe pat da na matu yaw shada ai n-gup magap)
EPDM gaw laklai ai nbung laru hpe ninghkap lu ai hte ozone hpe ninghkap lu ai molecular saturated hkrang hpe madun da ai. Shi a gram lajang da ai version gaw UL94 V-0 wan n-gun hpe pat shingdang ai madang ni hpe hkan sa nna, wan hkru ai shaloi wan n-gun hpe pat shingdang ai carbonized layer hpe hpaw ya ai sha n-ga, n-gun n law ai melt droplets ni hpe shapraw ya ai hte EVA hta grau n law ai wan hkut hpe madun dan ai.
Raitim, shi a tsaw ai-hpyen n-gun hpe ninghkap lu ai atsam hta asan sha ntsa tsang nga ai: aten galu-n-gun rawng ai bungli galaw ai n-gun gaw-40℃kaw nna 120℃du hkra sha rai nna, aten kadun-hpyen n-gun gaw 175℃hta n jan ai. 180℃jan ai nbung hpe matut manoi hkam sha yang, loi loi hte n-gun yawm mat nna, n-gun yawm mat na re; wan n-gun hpe n-hkap la lu ai carbon layer gaw 200℃jan katsi ai shaloi hten za mat nna, garan mat chye ai majaw, wan hpe n-hkap la lu ai atsam hpe sum mat chye ai.
Madung hku nna nbung laru shazim ai ladat, pipeline hpe shingdang ai hte pat da ai, shing nrai, aten kadun-npu -katsi ai nbung n-gun shayawm ai lam ni a matu jai lang ai; rai tim, PCB multilayer boards (sh) HDI n-gun ja ai-n-gun rawng ai n-gun rawng ai n-gun rawng ai ladat ni hte lang na matu n htap htuk ai.
EPDM hka htung hte hka htung
3. Wan n hkru ai foam silicone (PCB press sponge pads ni a matu hpaji jaw da ai arung arai)
Hpa majaw nga yang, n-gun ja ai -temperature industrial application ni a matu laksan galaw da ai ndai foam arung arai gaw, UL94 V{3}}0 ngu ai wan n-gun n-gun grau tsaw ai hpe tut nawng hkan sa ai madang masat da ai hkrang hpe lang ai majaw, mai lang ai ladat masum hta na wan n-gun hpe n-hkap la lu ai ladat masum hta na grau hkum tsup ai ladat langai rai nga ai.
Wan hkru ai atsam: Second 10 laman hpaw da ai wan hte hkra ai shaloi, shi hkum shi-lawan wan hkru mat nna, n-gun rawng ai wan hkru ai n-gun n lawm ai sha, ntsa kaw na carbonization loi mi sha madun dan ai; wan hkut n law ai, halogen-n lawm ai hte -n hkru n kaja ai, magri foil (sh) circuit board ni hpe awu asin di kau ya lu ai n hkru n kaja ai nbung ni hpe n shapraw ya ai.
Hpa majaw nga yang, 200–230℃lapran na nbung hpe aten galu hkam sharang lu ai, press langai hta 250℃du hkra aten kadun laman hta sha n-gun grai ja ai rai yang pyi, n-gun n rawng ai (sh) hkrat sum ai lam n byin shangun ai. Shi a pat da ai-cell hkrang gaw, n-gun n-gun hpe n-gun jaw ya ai; wan -retardant filler gaw nbung katsi ai shara hta n pru mat ai, n hkrat sum ai, wan hkru ai hpe ninghkap lu ai atsam gaw hkying hkum mi jan na ai hpang n yawm mat ai.
Madung akyu ni: sulfur-n lawm ai hte n-gun n rawng ai, bai lang na matu hkam sharang lu ai atsam kaba nga ai sha n-ga, madung ra kadawn ai lam masum hpe mung hkan sa ai-wan n-gun hpe hkam sharang lu ai atsam, rap ra ai n-gun hpe shingdang lu ai, hte n-gun ja ai-katsi ai hpe hkam sharang lu ai -hkum tsup ai hku htuk manu ai line{sa}fe CB pressing hte n-gun nnan tsaw-hkum hkrang n-gun hpe shingdang ai lam ni hpe jai lang ai.