Hpang na 5 ning laman, mungkan ting na silicone hpaga lam gaw, n-gun n yawm ai sha rawt jat galu kaba wa na hpe myit mada da ai, n-gun jat wa ai lam (CAGR) gaw 5% hte 7% lapran rai na re ngu sawn la ma ai.Ndai rawt jat galu kaba wa na matu madung lam gaw, n-gun nnan, tsi tsi ai lam hte hkamja lam hte seng ai, electronic hte wan jak ni zawn re ai, tsaw ai{0}}end hpaga lam ni a rawt jat galu kaba wa ai lam ni kaw na pru wa ai re. Ndai hpaga lam gaw, bungli galaw ai lam grai tsaw ai, shingra tara hpe makawp maga ai hte hkrak ai lam hpe madun dan na re.
Dai ni hta, silicone foam arung arai ni gaw, n-gun kaba ai wa ra sharawng ai lam kaw na akyu hkam sha lu na re, n-gun atsam battery nnan ni hta n-gun n-gun n-rawng ai hte n-gun n-gun n-rawng ai lam hpe ra sharawng ai kaw na akyu lu la na re, rawt jat galu kaba wa ai lam gaw, hpaga lam a shadawn shadang hta grau law na hpe myit mada ai (CAGR gaw 10% jan du lu na re. Solid silicone arung arai ni gaw, ndai hpaga lam a npawt nhpang hku nna, shanhte a laklai ai kam hpa mai ai lam hte shingra tara hpe n-gun jaw lu ai tsi hpaji hte tsaw ai-end sealing fields ni hta ngang grin ai rawt jat lam hpe matut nna makawp maga ya na re, dai shara ni hta galoi mung n-gun ja ai wa a-} a tsaw dik htum-ded area ni de galoi mung shang wa na re.
Silicone hpaga lam rawt jat galu kaba wa na matu shadut ya ai lam ni gaw:
N-gun atsam nnan hta wan jak mawdaw (EVs) ni a kapaw ai lam gaw grau kaba ai n-gun atsam rai nga ai. Silicone hpe gaw, battery pack ni hpe pat da ai, buffering hte insulation galaw ai hta grai lang ai, dai zawn sha, electronic hkang zing ai hte mawdaw masa ni hta thermal conductive potting hte insulate sheets ni hta mung jai lang ai. Piles hte n-gun hpe shinggyin tawn da ai ladat (ESS) ni hpe mung charge galaw na matu ra ai arung arai law law ra ai.
Tsi hpaji hte hkamja lam hte seng ai bungli: Masha law law a asak kaba wa ai, hkamja lam hpe grau chye na ai lam, hte bungli galaw ai lam hta grai tsaw ai tsi mawan ni hpe ra sharawng ai majaw, tsi tsi ai lam a matu tsi mawan-}grade silicone gat lawk hpe rawt jat wa shangun ai. Implants, catheter ni, nsa sa ai mask ni, tsi htu ai ntsin htung ni hpe pat da ai ni lawm ai.
Electronic hte wan jak hpaga lam: 5G/6G matut mahkai lam, artificial intelligence, hte bu hpun mai ai arung arai ni hpe gyin shalat ai lam gaw, n-gun ja ai thermal, wan n-gun, n-gun rawng ai silicone ni hpe matut nna ra sharawng ai lam hpe matut manoi galaw ya nga ai. Silicone gaw chip packaging, nbung hpe shapraw kau ai module ni, keyboard pads zawn re ai sun ni hta n mai malap ai.
Hpa majaw nga yang, n-gun n rawng ai, n hkru n kaja ai hte katsi ai- hpe ninghkap lu ai malu masha a ra kadawn ai lam hpe gram lajang ai lam hte grup yin hpe makawp maga ai tara ni: N-gun n rawng ai, n-gun n rawng ai, n-gun n rawng ai malu masha ni hpe ra sharawng ai lam gaw rawt jat wa nga ai. Dai aten hta, grup yin hpe makawp maga ai tara ni gaw, grup yin hpe grau nna n hkra hkra galaw shapraw ai lam ni hte bai jai lang mai ai arung arai ni de, ndai hpaga lam hpe shadut nga ai.
Silicone hpaga lam hpe gyin shalat na matu shadawn sharam ai lam ni gaw:
1.Raw arung arai manu ni hta galai shai ai lam ni: Raw arung arai kaba ni ( metalllic silicon, DMC, etc. zawn re ai) ni gaw n-gun atsam masa ni hte jaw ai lam hte jaw ai lam ni a majaw hkra machyi hkrum ai majaw, manu dan ai galai shai ai lam ni hpe byin shangun ai, dai gaw galaw shapraw ai hpaga hpung ni a akyu hpe yak hkak shangun nga ai.
2.Hpaji masa hpe pat shingdang ai lam ni hte hpaji ningnan ni hpe n-gun jaw ai lam ni:Downstream application ni hta grau law ai bungli galaw ra ai lam ni nga ai (ga shadawn, thermal conductivity grau law ai, wan n-gun grau law ai, grau n-gun yawm ai zawn re ai), hpaga hpung ni hpe sawk sagawn ai lam hte rawt jat galu kaba lam hta matut manoi gumhpraw bang na matu shadut ya ai.
3. Sut masa shingjawng ai lam hpe grai ra sharawng ai:grau nna, mid- to mid- hpe, shingjawng ai lam gaw n-gun ja ai hte manu jahpu majan ni a dip sha ai lam nga ai.