Foamed silicone gaw, grai katsi ai hpe ninghkap lu ai, wan n hkru ai, hkam sharang lu ai, hte n-gun n rawng ai atsam ni hpe kayau kaya hpawng de da ai, n-gun nnan, electronics, hkamja lam zawn re ai magam bungli ni hta ahkyak ai npawt nhpang arung arai langai hku nna magam gun nga ai. Mungkan ting na gat lawk gaw n-gun rawng ai hku rawt jat wa ai hpe hkam sha nga ai, 2023 ning hta USD wan 1.87 billion du wa ai, 2024 ning kaw nna 2029 ning du hkra 6.8% daram rawt jat galu kaba wa na re ngu sawn la ma ai. shi a rawt jat galu kaba lam a myit masa, hpaji masa lam ni, gat lawk hkrang masa, hte tara masa woi awn ai lam ni hta laklai ai arawn alai ni hpe madun dan ai-Uropa, Amerikan, Japan, Dingda Korea mungdan ni hta nga ai ni hte npawt nhpang hku nna shai ai. Europe hte US gaw high-hpang jahtum na pat shingdang ai lam ni hpe madung tawn nna, Japan hte Dingda Korea gaw hkrak tup galaw shapraw ai lam hpe ahkyak shatai nna, Miwa gaw "scale ningbaw ningla + mabyin masa-shadut ai rawt jat lam + hkum tsup ai-chain shang wa ai lam + manu jahpu hte bai nhtang galaw ai akyu ni," esta{1 mungkan ting na hpaga lam shingra tara kata kaw nga ai.
I. Industry Scale hte Growth Rate: Mungkan Rawt Jat Ai Lam A Madung, Hpaga Lam Hpe Laksan Hkringmang Daju Ai Hpaga Lam Hpe Hkrang Shapraw Ai Lam Hpe Hkrang Shapraw Ai Lam Hpe Hkrang Shapraw Ai Lam
Mungkan ting na foam silicone galaw shapraw ai atsam gaw Sinpraw Asia, Dingdung Amerika, hte Dingda Uropa mungdan ni hta madung tawn nna, 2024 ning hta yawng ton 287,000 daram galaw shapraw lu na re. shadawn shadang. 2023 ning hta Miwa mungdan a gat lawk gaw RMB 5.23 billion du wa nna, du na 5 ning laman CAGR 9.2%-mungkan ting na shadawn shadang- hta grau law nna, 2030 ning du wa ai shaloi mungkan gat lawk hta 35% jan lawm na re ngu sawn la ma ai.
(1) Uropa hte Amerikan mungdan ni hte shingdaw yu yang: Scale hte rawt jat lam hta "Generation Gap" nga ai
Europe hte America mungdan ni hta hpawng de nna galaw shapraw lu ai atsam gaw ton 71,000 daram (American mungdan hta ton 42,000, Dingdung Europe mungdan hta ton 29,000) rai nna, yawng hta na 24.7% rai nna, rawt jat galu kaba wa ai lam gaw 5%–6% sha rai nga ai. US gaw high-end electronics hte aerospace hpe madung tawn nna, Europe gaw mawdaw hte gawgap ai lam ni hpe ahkyak shatai nna, dai ni gaw kungkyang sai raitim, n-gun n rawng ai rawt jat lam hpe madun dan ai, oligopolistic uphkang ai lam hte manu jahpu manu dan ai lam ni hpe madun dan ai (ga shadawn, Dow, Wacker, 3M). Miwa mung gaw, maga mi de, "lawan ai hku rawt jat galu kaba wa ai hte rau, n-gun jat wa ai" ngu ai lahkawng lang na -madun ai ladat hpe madun dan nga ai, 2026 ning du hkra RMB wan 22.4 billion daram gat lawk hpe sawn la ai, dai gaw shaning mi {21}s-shaning hta 12% jat wa ai hpe madi madun ai, pa hpe hpaw shabawn ai. Europe hte America mungdan ni hta nga ai hte Miwa mungdan a ginra shagu hta hkum tsup ai hku jat wa ai lam hpe ninghkap ai."
(II) Japan hte Dingda Korea hte shingdaw yu yang: Hpaga galaw shapraw ai atsam grau law ai hte grau n-gun ja ai jat wa ai atsam
Japan (58,000 tons, 20.2%) hte Dingda Korea (31,000 tons, 10.8%) ni gaw, hpaji hparat lam hta pat shingdang ai lam ni grai law ai raitim, sadi maja let atsam jat wa ai lam ni hpe madun ai, n-gun ja ai-hpang jahtum hkrak ai galaw shapraw ai lam hte dut shabra ai lam hpe madung tawn ai. Miwa mungdan a galaw shapraw lu ai atsam gaw Japan hte Dingda Korea mungdan ni yawng hpe shingdaw yu yang htam 1.4 daram law nna, 2026 ning hte 2030 ning lapran (madung hku nna Sinpraw hte Dingda Miwa mungdan ni hta) concentrated capacity shapraw ai lam nnan hpe myit mada da ai. 2030 ning du wa ai shaloi, yawng hkra galaw lu ai atsam gaw ton 120,000 jan rai nna, Japan hte Dingda Korea mungdan ni a rawt jat galu kaba wa ai hta grau law wa na re. Japan hte Dingda Korea gaw "hpaji masa pat shingdang ai lam ni + manu dan ai lam kaba" hpe shanhte a madung shingjawng ai lam hku nna kam hpa nga ai ten, Miwa gaw "scale effects + hkum tsup ai hpaga lam hpe madi shadaw ai lam" hku nna shi a akyu hpe gawgap nga ai, dai gaw laklai ai shai hkat ai lam hpe shabyin ya ai: "Japan hte Dingda Korea gaw laksan hpaji hta grau kungkyang ai, Miwa gaw scale hte hkum tsup ai lam hpe gumrawng nga ai."
II. Hpaji masa: Application-Oriented Rapid Iteration hte Mid- kaw nna-Low End hte High-End Segment ni hta kalang ta byin pru wa ai lam ni hpe galaw ai
Mungkan hpaji masa hta, Europe hte America gaw, n-gun ja ai npawt nhpang hpaji masa ni hpe uphkang nga ai (supercritical CO2 foaming hte tsi mawan-grade n-gun ja ai-san seng ai n-gun dat ni hpe uphkang nga ai, Japan hte Dingda Korea gaw, hkrak tup hkrang shapraw ai lam hte ngang grin ai lam hpe hkang lu ai lam hta grau kungkyang ai (ga shadawn, n-gun n bung ai n-gun hte n-gun n law ai). Miwa mungdan a hpaji masa ladat gaw, "application-driven hpaji ningnan, lawan ai hku bai galaw ai lam, hte layered breakthroughs ni" ngu ai laklai ai lam hpe madun dan nga ai -dai gaw, npawt nhpang npawt nhpang ningmu ni hpe myi nmu ai sha hkan shachyut ai sha, de a malai, npu na application ni hta hkra machyi ai lam ni hpe hparan ai lam hpe madung tawn ai, manu jahpu hpe hkang lu ai atsam hpe gawgap ai, high-end sector ni hta mungdan kata na galai shai ai lam.
(1) Process Route: Matut manoi galaw ai lam hpe ahkyak shatai nna, manu n law ai hku nna, kaba ai-masha law law hpe galaw shapraw na matu
Europe hte America mungdan ni gaw, n-gun ja ai laksan galaw ai ladat ni hpe madung tawn ai (mold{1}}pressed foaming hte FIPFG on-site molding zawn re ai), batch kaji, manu kaba ai-jat bang ai application ni a matu htuk manu ai. Miwa mungdan chyawm gaw, madung hku nna matut manoi shapraw ai foaming hpe jai lang ai, n-gun n law ai pore size (80–200 μm), hpaw da ai-cell rate 95% jan, n-gun n law ai (CV manu k 5% hta n law ai (sh) dai hte maren sha re ai), n-gun n law ai (hW2k/h2k). n-gun mawdaw nnan ni hte 5G matut mahkai lam zawn re ai -scale application kaba ni a matu grai kaja ai. Dai aten hta, Miwa company ni gaw, tsi mawan ni hpe lawan ladan gram lajang nna, maigan de na dut shabra ai platinum n-gun dat ni hpe kam hpa ai lam hpe shayawm ya lu ai, dai hku nna, European hte American prat na n-gun ja ai American ni hte shingdaw yang, n-gun ja ai n-gun ja ai arung arai ni a matu 30%–50% manu jahpu shayawm lu ai. Miwa mungdan a manu jahpu-htuk manu ai law law galaw shapraw ai lam hte shingdaw nna, hkrak tup ai ladat ni."
(II) Hpaji ningnan hpe madung tawn ai: Context-Buga ginra ra kadawn ai lam ni hpe hkap la lu na matu, laksan gram lajang ai lam hte hpawng de ai lam ni hpe gram lajang ai lam
Europe hte America mungdan ni hta hpaji ningnan ni gaw, galu kaba ai R&D shingjawng ai lam ni hte gumhpraw law law bang ai lam ni hpe madun ai, n-gun ja ai ginra ni (bio- hpe madung tawn ai silica gel, nanocomposites, hte n-gun ja ai sensor ni zawn re ai ni hpe madung tawn ai. Raitim, Miwa mungdan gaw, shi a shakut shaja ai lam hpe "real-world pain points" ni hta madung tawn nna, buga na akyu rawng ai hpaga lam ni hte maren lawan ladan bai galaw nga ai: n-gun nnan mawdaw battery pack hpe pat da na matu, n-gun n law ai prat tup n-gun n rawng ai, wan hkru ai hpe n-gun n rawng ai, electrolyte hpe ninghkap lu ai laksan arung arai ni hpe galaw shapraw ai; 5G npawt nhpang station hpe katsi shangun na matu, n-gun grau ja ai hte dielectric sum ai lam n law ai foam silica gel hpe galaw shapraw ya ai; n-gun n rawng ai electronics ni a matu, ultra-n-gun n rawng ai, n-gun rawng ai, n-gun rawng ai -VOC arung arai ni hpe shapraw ai. Ndai "kadun ai, n-gun n rawng ai, lawan ai" hpaji ningnan hkrang gaw Miwa company ni hpe shata 3–6 laman ra kadawn ai kaw nna law law galaw shapraw ai de htawt sit lu shangun ai -Uropa hte America mungdan ni hta shata 12–18- hta grau lawan ai hku galaw lu ai rai nna, Miwa mungdan ni hta laklai ai hpaji masa hku nna ahkyak shatai ai lam ni hpe mu tam ai: "Europeasize tatut jai lang ai lam ni."
(III) High-end shingjawng poi: Mungdan kata na galai shai ai lam hpe lawan ladan galaw lu ai hte masat masa galaw ai lam hta pat shingdang ai lam ni hpe lawan ladan galaw lu ai
Uropa, Amerikan, Japan, Dingda Korea ni gaw mawdaw-grade, tsi mawan-grade, hte semiconductor-grade arung arai ni a matu, AEC-Q200, FDA, hte LFGB zawn re ai masat masa ni lawm ai madung pat shingdang ai lam ni hta, n-gun kaba ai gat lawk ni hpe aten na na uphkang lai wa sai. Kade nna ai aten hta, Miwa mungdan na hpaga hpung ni gaw, shanhte a rawt jat lam ni hpe lawan ladan galaw wa sai: 2025 ning du wa ai shaloi, mawdaw-grade hpaga hpung 17 gaw AEC-Q200 masat masa lu la sai, 2024 ning hte shingdaw yang 5 jat wa ai; tsi mawan-grade arung arai ni gaw LFGB madang ni hte loi loi hte maren sha rai nga ai, 2025 ning September shata hta shapraw ai GB 4806.16-2025 madang gaw madung hku nna LFGB chyam dinglik ai lam hte maren sha rai nga ai, high-end segment ni hta galai shai ai lam hpe lawan ladan galaw ya nga ai. Uropa hte US ni a "ten galu -hkum hkrang uphkang ai lam hte hpaji masa hpe pat shingdang ai lam" hte n bung ai sha, Miwa gaw laklai ai lam hpe hkan sa ai ** "lawan ai hku rim la ai-up hte layered breakthroughs" -s hpe hkum tsup ai hku woi awn nna, lapran - kaw nna-segment ni hta - du hkra peripheral application ni hte loi loi hte core domain ni de shang wa ai.
III. Gat lawk hkrang: Ra kadawn ai lam- hpe shadut ai hte grai myit maju jung ai, n-gun nnan hpe madung shadut ai hku nna lang ai
Mungkan ting na foam silicone hpe ra sharawng ai hkrang gaw amyu myu nga ai: Europe hte America mungdan ni hta jai lang ai electronics, nbungli, hte high-end tsi mawan jai lang ai lam ni hta rap ra ai hku garan gachyan ai lam; Japan hte Dingda Korea mungdan ni hta mawdaw hte electronic hpaga lam kaw na dual drivers ni rai nna, maigan de dut shabra ai lam gaw 50% jan rai nga ai. Miwa mungdan a gat lawk gaw, "n-gun atsam mawdaw nnan ni a tsep kawp uphkang ai lam, 5G matut mahkai lam kaw nna ngang kang ai madi shadaw ai lam, tsi mawan hte jai lang ai electronics ni hta lawan ai hku rawt jat wa ai lam ni" hte grai myit maju jung ai hkrang hpe madun dan nga ai, lawu na ra kadawn ai lam gaw mungdan a akyu rawng ai hpaga lam ni hte sung sung htuk manu hkra matut mahkai nna, laklai ai "Miwa ra kadawn ai lam hkrang" hpe hpaw shabawn da ai.
(1) N-gun Mawdaw Nnan: Mungkan hta kaba dik htum ai standalone gat lawk rai nna, yawng ra kadawn ai lam hta 40% jan hpe hkam la lu ai
Miwa gaw n-gun atsam mawdaw nnan ni hpe galaw shapraw ai hte dut shabra ai lam lahkawng yan hta mungkan hta ningbaw ningla shara hpe shaning law law matut manoi tawn da nga ai. 2026 ning hta dut shabra na matu yaw shada ai hpe wan 14.5 de jat wa ai majaw, foam silicone hpe ra sharawng ai lam grau law wa ai hpe hkrak shabyin ya ai. 2025 ning hta, n-gun atsam mawdaw nnan hpaga lam hta mari la ai manu gaw RMB wan 8.64 du wa nna, ndai hpaga lam yawng a 43.2% hpe hkam la ai, madung hku nna battery pack hpe pat da ai, cushioning galaw ai, nbung n-gun hpe pat da ai, mawdaw hpe pat da ai, wiring harness ni hpe n-gun jaw ai lam ni hta jai lang ai. Europe hte America mungdan ni hta n-gun atsam mawdaw nnan ni a gat lawk gaw Miwa mungdan hta masum hta na langai-sha rai nna, ra kadawn ai lam gaw daw garan nga ai; Japan hte Dingda Korea gaw maigan de dut shabra ai lam hpe madung tawn nna, mungdan kata na gat lawk ni gaw n law ai. N-gun atsam mawdaw nnan ni hpe shi a madung lam hku nna, Miwa gaw "mungkan hta kaba dik htum ai jai lang ai lam ni + grau hkum tsup ai hpaga lam masa + grau sawng ai shingjawng ai lam" ni hte laklai ai gat lawk shingra tara hpe gawgap da sai, dai gaw, arung arai ni hpe bai galaw ai lam hpe lawan ladan galaw lu ai hte, manu jahpu hpe matut manoi shayawm lu ai.
(II) 5G matut mahkai lam hte jai lang ai ni a Electronics: Lawan ai hku jat wa na matu buga ginra na hpaga lam a akyu ara ni hpe jai lang ai
Miwa gaw 5G base station gawgap ai lam hta mungkan hpe ningbaw ningla galaw nga ai, grai law hkra jai lang ai electronics ni hpe garan gachyan ai lam (Apple hte Android garan gachyan ai lam ni gaw Dingda Miwa mung hta madung nga ai), foam silicone hpe ra sharawng ai lam lawan ai hku rawt jat wa ai hpe shabyin ya nga ai. 2025 ning hta, telecommunication arung arai ni hta mari la ai manu gaw RMB wan 4.98 du wa nna, yawng hta na 24.9% rai nga ai; lang ai electronics ni gaw 15% daram rai nna, madung hku nna smartphone, tablet, hte bu hpun mai ai arung arai ni hta shinggrup da ai, shinggrup da ai, katsi ai hpe shapraw kau na matu jai lang ai. European hte American mungdan ni a jai lang ai electronics gat lawk ni gaw, 5G hpe shayawm ai hku nna, n-gun rawng nga ai; Japan hte Dingda Korea mungdan na electronics hpaga lam ni gaw maigan de htawt sit mat ai majaw, ra kadawn ai lam yawm mat wa ai. Miwa mungdan gaw shi a mungdan kata na garan gachyan ai lam a agglomeration effect hpe jai lang let, "ra sharawng ai lam – R&D – galaw shapraw ai lam – htaw sa ai lam" ngu ai pat da ai -loop masa hpe lu la sai, mahtai jaw ai lawan ai hte manu jahpu hpe shayawm lu ai hta ahkyak ai akyu ni hpe jaw ya lu ai, dai gaw "America hta ra kadawn ai lam hpe ngang grin hkra galaw ya ai, Miwa mungdan hta ra kadawn ai lam hpe jat wa shangun ai."
(III) Hkamja lam hte hkai sun nta ni: Policy-madung ai mai byin ai lam ni hpe shapraw kau na
Europe hte America mungdan ni hta tsi hpaji hte hkai sun galaw ai lam hta ra kadawn ai lam gaw kungkyang sai, 30% jan rai nna, grai sawng ai madang ni (FDA, LFGB, hte EU REACH ni masat da ai zawn re ai) ni nga ai. Miwa mung hta, tsi hpaji gaw, gat lawk hta 7.7% daram lawm ai raitim, ra kadawn ai lam lawan ai hku rawt jat wa ai gaw, masha jahpan kaba wa ai hte jai lang ai lam rawt jat wa ai majaw re; hkai sun galaw ai lam gaw "dual carbon" ladat kaw na akyu hkam sha lu ai, n-gun n law ai-VOC hte wan n-gun n-htum ai foam silicone gaw htunghking arung arai ni hpe loi loi hte galai shai kau ai. Europe hte America mungdan ni hta "standard-shawng nnan, ngang grin ai ra kadawn ai lam" ladat hte n bung ai sha, Miwa mung gaw ** "policy lam matsun ai hte lawan ai hku shang wa ai" ngu ai arawn alai hpe madun dan ai -2025 ning hta malu masha-grade silicone policy nnan ni hpe hkan sa ai lam gaw tsi hpaji arung arai ni hpe buga ginra de lawan ladan jat wa shangun nga ai. n-gun n law ai - jai lang ai foam silicone hpe jai lang ai, gat lawk a atsam hpe loi loi hte hpaw ya ai.
IV. Hpaga lam hte shingjawng ai lam: Chain ting hta hkum tsup ai hku uphkang lu ai, Private Sector hpe grau nna myit maju jung ai hte uphkang lu ai
Mungkan ting na hpaga lam npawt nhpang shingra tara: Europe hte America gaw "ntsa kaw na n-gun rawng ai arung arai ni + npu de na n-gun rawng ai arung arai ni" (**ga shadawn, Dow hte Wacker gaw silicone rubber, silica wan n-ga, hte n-gun rawng ai arung arai ni a n-gun rawng ai arung arai ni yawng hpe uphkang ai); Japan hte Dingda Korea gaw "midstream hkrak hkrak galaw shapraw ai lam + maigan de dut shabra ai lam" hpe madung tawn nna, mungdan kata na kaba dik ai ni (Shin-Etsu hte Mitsubishi) ni hpe kam hpa nna, n-gun ja ai arung arai ni a matu galaw shapraw ai. Raitim, Miwa mung gaw, laklai ai hkrang langai hpe gyin shalat da ai, "upstream n-gun kaba ai + midstream agglomeration + downstream madi shadaw ai lam," hkum tsup ai-chain autonomy hte controllable (**) hpe lu la ai, laksan hpaga hpung kaji ni hte lapran tsang -sized hpaga hpung ni hpe uphkang nna, hpaga lam ningbaw ningla ni hpe lawan ai hku shinggyin la lu ai, n-gun ja ai ye arawn alai hpe madun dan ai. rai tim, hpawng de nga ai."
(1) Upstream: Imports hpe kam hpa ai kaw nna, loi loi hte tinang hkum tinang-hkum tsup wa hkra, manu jahpu akyu ni dan dawng wa ai
Uropa, Amerika, Japan, Dingda Korea mungdan ni gaw, n-gun ja ai methyl vinyl silicone rubber, fumed silica, platinum catalysts zawn re ai, n-gun ja ai arung arai ni hpe aten na na lang nna, n-gun ja ai arung arai ni hpe lang nga ma ai. Kade nna ai aten hta, Miwa mungdan na hpaga hpung ni gaw, lawan ladan rawt jat wa ai: Hesheng Silicon Industry hte Dongyue Group zawn re ai company ni gaw, DMC (dimethylcyclosiloxane) hte Silicone Rubber ni hpe kaba ai hku galaw shapraw lu wa sai. 2023 ning hta, DMC manu ni gaw ton mi hta ¥10,500 kaw nna bai rawt jat wa ai, mungdan kata na raw materials ni gaw 70% jan galaw shapraw ai hte manu gaw maigan de dut shabra ai kaga ladat ni hta 20%–30% shayawm ai. High-end electronic-grade hte tsi mawan-grade raw arung arai ni gaw maigan de dut shabra ai lam hpe naw kam hpa nga ai raitim, upstream supply hta tinang hkum tinang hkum tsup ai lam gaw matut nna rawt jat wa nga ai, dai gaw "Europe hte US gaw high-grade raw arung arai ni hpe langai hkrai sha lang nna, Miwa mungdan gaw madang tsaw ai arung arai ni hpe langai hkrai sha zing madu da ai" ngu ai shai hkat ai lam hpe shabyin ya nga ai. mid-to-npu-hpang jahtum na arung arai ni," dai hku nna midstream sector hta manu jahpu-htuk manu ai hku law law galaw shapraw ai lam hpe madi shadaw ya ai.
(II) Midstream: Private sector ni a uphkang ai lam, hpawng de nna galaw shapraw lu ai atsam, hte lawan ladan jat wa ai gat lawk hta myit maju jung ai lam .
Uropa, America, Miwa mungdan ni hta nga ai lapran tsang daw gaw, oligopolistic uphkang ai lam (3M, Dow, Wacker zawn re ai company ni uphkang ai) hte galaw shapraw lu ai atsam hpe hpaga hpung nkau mi hta sha madung tawn ai; Japan hte Dingda Korea hpe n-gun ja ai niche market ni hpe madung tawn nna, hkrak tup hkrak galaw shapraw ai company nkau mi woi awn nga ai. Miwa mung hta, lapran tsang daw gaw "madung hku nna, sut masa kaji hte lapran tsang-hpaji hpaga hpung ni, ginra garan ginhka ai lam, hte myit maju jung ai lam law wa ai" a arawn alai ni hpe madun dan nga ai: mungdan ting hta hpaga yumga 200 daram nga ai, CR5 (top five enterprise concentration) gaw Dingda America, Korea, Europe, 2000 hta grau nna 38% daram yawm ai. 70% re. Hpaga lam galaw shapraw ai atsam gaw Sinpraw Miwa (Jiangsu hte Zhejiang) hte Dingda Miwa (Guangdong) hta madung tawn nna, Jiangsu gaw shi a silicone hpaga lam hpe n-gun jaw ai madung shara hku nna galaw nga ai rai nna, Guangdong gaw electronic jai lang ai lam ni hpe madung tawn ai. Kade nna ai aten hta, ningbaw ningla hpaga hpung ni (Huitian New Materials, Tiansheng New Materials, Zhonglan Chenguang zawn re ai ni) gaw jat wa ai lam hte hpawng de ai lam ni hpe lawan ladan galaw wa sai, CR5 gaw 2026 ning du hkra 50% de rawt jat wa na hpe myit mada ai, ndai gaw garan ginhka ai lam kaw nna{}end kaw nna{}end du hkra galai shai wa ai lam hpe madun dan ai. high-end-Uropa hte Amerika mungdan ni hta mu lu ai "galu kaba ai oligopoly" hte grai shai ai.
(3) Downstream: Lawan ai hku buga madi shadaw ai lam hte hkrang shapraw ai lam hpe tup hkrak tsun dan ai
Uropa hte America mungdan ni hta nga ai npu na high-end sectors (nbungli, hkamja lam rawt jat galu kaba wa ai, manu dan ai electronics) ni gaw uphkang nga ai, niche customized ra sharawng ai lam law law nga ai; Japan hte Dingda Korea mungdan ni gaw mawdaw hte electronic arung arai ni hpe maigan de dut shabra ai lam hpe ahkyak shatai nna, buga kata na madi shadaw ai hpaga hpung ni law law n nga ai. Raitim, Miwa mung gaw, npu na masa yawng hpe, hkum tsup ai buga ginra madi shadaw ai atsam ni hte shinggrup da ai: n-gun atsam mawdaw nnan ni, 5G matut mahkai lam, jai lang ai electronics, hkamja lam, hte gawgap ai lam ni zawn re ai ginra ni hta, npu na htinggaw ni hpe myit maju jung ai hte, lawan ai hku bai htang ai aten ni hpe madun dan ai. plants ni hta, "24-hour ra kadawn ai lam hpe htai ya lu ai, 7 ya tup sample sa ya lu ai, 30 ya tup law law jaw lu ai," Europe, America, Japan, hte Dingda Korea (shata 1–3) ni hta grau lawan ai hku galaw lu ai. Ndai ** "downstream-driven, buga kaw nna madi shadaw ai, lawan ai hku bai htang ai" hkrang** gaw Miwa a laklai ai hpaga lam shingjawng ai atsam hpe madi madun nna, maigan de na dut shabra ai arung arai ni hpe lawan ai hku galai shai kau ai a madung lam hpe madi madun nga ai.
V. Tara masa ni hte galu kaba lam: Dual Carbon masing kaw nna n-gun ja ai n-gun gaw Green Transition hpe lawan ladan galaw ya ai
Mungkan ting na tara masa hpe madung tawn ai: Europe hte America mungdan ni gaw "standard-shawng nnan, grup yin hpe pat shingdang ai lam" ladat (REACH, LFGB, hte EU carbon tariff zawn re ai) hpe hkap la nna, n-gun ja ai-end eco-hkum tsup ai arung arai ni hpe jai lang ai lam hpe n-gun jaw ai; Japan hte Dingda Korea gaw, hpaga lam ni hpe maigan mungdan ni hta nga ai high-end market ni de jat wa na matu n-gun jaw na matu, "maigan de dut shabra ai lam a matu hpaga lam masa madi shadaw ai lam" hpe kam hpa nga ma ai. Miwa mung gaw, maga mi de, "policy lam matsun, gat lawk ningbaw ningla, hte lawan ladan hkai sun galai shai ai lam" ni hte laklai ai lam hpe gyin shalat na matu, "dual-carbon ladat + hpaga lam masing jahkrat ai lam + mungdan kata na ra kadawn ai lam hpe shadut ai lam" - hpe jai lang ai.
(1) Dual Carbon Strategy: Hkrang nsam hpe galaw shapraw ai lam hte VOC n law ai arung arai ni hpe ra kadawn ai lam ni byin wa ai
Miwa mungdan a "dual carbon" yaw shada lam ni a majaw, n law ai-VOC, halogen-wan n hkru ai-n hkru n kaja ai, bai jai lang mai ai foam silicone arung arai ni hpe grai law hkra jai lang wa sai. 2025 ning hta, malu masha-grade silicone madang nnan GB 4806.16-2025 hpe hkan sa hpang wa nna, LFGB madang ni hte maren, n-gun n rawng ai organic compounds (VOCs) ra kadawn ai lam hpe shalawm wa ai majaw, hpaga hpung ni hpe hkai sun gram lajang ai lam ni hpe galaw na matu shadut ya ai. Europe hte America mungdan ni hta grup yin tara ni gaw grai ja ai raitim, shanhte gaw madung hku nna hkan sa na matu manu jahpu pat shingdang ai lam ni hpe kam hpa nga ai; Raitim, Miwa mungdan gaw, shingra tara hpe makawp maga ai hpaji masa ni hta, tara masa garum ningtum hte ahkun hkanse n-gun jaw ai lam hku nna, company ni a gumhpraw bang ai lam hpe n-gun jaw nga ai-ga shadawn, supercritical CO2 foaming galaw ai lam (VOC dat dat ai lam hpe 92% shayawm ai) hte bio-madung tawn ai barrier silicone sawk sagawn ai lam{a{13} hte Miwa ni a n-gun jaw ai lam ni hpe mung galaw ai."
(II) Hpaga lam masing jahkrat ai lam: N-gun nnan hte High-End galaw shapraw ai lam a matu ngang kang ai policy madi shadaw ai lam
"N-gun nnan mawdaw hpaga lam rawt jat galu kaba wa na masing (2021–2035)" hte "Electronic shiga galaw shapraw ai hpaga lam rawt jat galu kaba wa na matu 14 ning na masing" zawn re ai tara masa ni gaw, n-gun ja ai arung arai ni hpe n-gun jaw ai, n-gun n rawng ai arung arai ni hpe n-gun jaw ai, n-gun n rawng ai arung arai ni hpe n-gun jaw ai, foam silicone a matu ra sharawng ai lam hte policy n-gun jaw ai lam ni hpe galaw ai. Europe hte America mungdan ni a hpaga lam masa ni gaw, high-end hpaji masa R&D a matu garum ningtum jaw ai lam hpe madung tawn ai; Japan hte Dingda Korea gaw maigan de dut shabra ai ahkun hkanse hpe shayawm ya ai hte maigan mungdan ni a gat lawk hpe jat wa na hpe ahkyak shatai nna; Raitim, Miwa gaw, mungdan kata na ra kadawn ai lam hpe hkai lu hkai sha ai lam hpe ahkyak shatai nna, n-gun atsam mawdaw nnan ni hte 5G npawt nhpang dap ni a matu, npu de na ra kadawn ai lam hpe jat wa na matu, garum ningtum jaw ai hte mari ai ahkun hkanse hpe shayawm ai zawn re ai masa ni hpe jai lang ai, dai hku nna, foam silicone hpaga lam hpe n hkrak ai hku rawt jat wa shangun ai. Ndai gaw laklai ai policy logic hpe madun dan ai: "Europe hte US gaw R&D hpe ahkyak shatai nna, Japan hte South Korea gaw maigan de dut shabra ai lam hpe madung tawn nna, Miwa gaw mungdan kata na jai lang ai lam hpe ahkyak shatai nna galaw ai."
Hpang jahtum tsun ga nga yang, Miwa mungdan a foam silicone hpaga lam a laklai ai lam gaw, "scale garan gachyan ai lam + scenario garan gachyan ai lam + policy garan gachyan ai lam + manu jahpu hte bai kahtap tsun ai akyu ni" ngu ai shada da karum shingtau ai lam hta madung nga ai, dai gaw Uropa, Amerikan, Japan, Dingda Korea mungdan ni hte laklai ai hku shai ai rawt jat galu kaba lam masa hpe hpaw shabawn ai. oligopolistic uphkang ai lam + manu dan ai lam kaba ai"; Japan hte Dingda Korea gaw "htuk manu ai hku galaw shapraw ai + maigan de dut shabra ai lam + ngang grin ai manu jahpu" hpe madun ai laksan hkrang hpe hkap la ma ai; Miwa gaw "scale ningbaw ningla + hkum tsup ai-chain shang wa ai lam + jai lang ai lam-n-gun jaw ai hpaji ningnan + lawan ai hku bai galaw ai lam" ngu nna lachyum shaleng da ai hkum tsup ai hkrang hpe hkan sa nga ai.
Htawm hpang de, Miwa mungdan a foam silicone hpaga lam gaw, "high-end rawt jat galu kaba lam, hkai sun galai shai ai lam, hte hpawng de ai lam" ngu ai masa hpe matut galaw sa wa na re: Aten kadun (1–2 ning) hta, lapran - kaw nna -low-end segment ni hta n-gun grau law wa na, manu shingjawng ai lam hpe grau jat wa shangun nna, manu shingjawng ai lam hpe grau jat wa shangun na, CR5 share hpe 50% jan de; lapran aten (3–5 ning) hta, mungdan kata na high-end galai shai ai lam gaw lawan ladan byin wa na re, mawdaw-grade, tsi mawan-grade, hte semiconductor-grade arung arai ni grau law wa na re, dai hte rau, hkai sun hpaji masa ni hpe grai law hkra jai lang wa na re. nano-hkum hkrang n-gun; aten galu (5–10 ning) hta, ndai hpaga lam gaw "hpyen n-gun rawng ai arung arai ni hta tinang hkum tinang hkamja lam lu la ai, rawt jat galu kaba wa ai lapran daw galaw shapraw ai lam, mungkan ting hta n-gun rawng ai arung arai ni hpe garan gachyan ai lam ni" hku nna laklai ai hkum tsup ai shingjawng ai lam hpe gawgap na re, "madung galaw shapraw ai wa" kaw nna "hpaji hparat n-gun kaba ai shara" de galai shai wa nna, mungkan ting na hpaga lam hta n-gun kaba ai shara langai mi de galai shai wa na re.