I. Shawng nnan na daw: Kahkyin gumdin ai garan ginhka ai ladat n nga ai (1930–1971)
Hpaga lam rawt malan ai hpang, plastic hte foam arung arai ni hpe grai lang wa nna, EVA, rubber, hte resin ni hpe nta kata na arung arai ni, nbung hpe n-gun n jaw ai, electronic ni hta grai lang wa ai; rai tim, wan hkru ai lam hpe jep joi ai lam hpe madang masat da ai ladat n nga ai.
1930s: American ASTM madang gaw, wan hkru ai lam hpe shawng ningnan lang chyam dinglik ai lam hpe hpaw hpang wa ai, n-gun n-gun hpe sha shadawn nna, "slow-burning" hte "fast-burning" hpe garan ginhka ai, vertical wan hkru ai lam (sh) droplet risk hpe jep joi ai lam n nga ai.
1950s–1960s: Electronic jak ni hte seng nna wan hkru ai lam ni grai law wa ai; secondary wan hkru shangun lu ai molten droplets ni nga ai gaw grai kaba ai hkrit tsang hpa byin shangun ai, rai tim vertical flame retardancy a matu mungkan ting hta langai sha re ai garan ginhka ai ladat n nga ai.
Madung hpaga lam hta hkrum katut ra ai mayak mahkak ni: EVA hte htunghking rubber a matu, wan hkru ai lam hpe myi man hte sha jep joi lu ai; laboratory amyu myu kaw na chyam dinglik ai mahtai ni gaw, arai langai sha a matu tsep kawp n htap htuk ai; hte maigan de dut shabra ai-madung ai electronics hte PCB hpaga lam ni a matu langai sha re ai shimlam madang n nga ai.
II. Shawng nnan na Madang Shangai wa ai: Madung Madang Masum-Hpaji Masa hpe Gawgap Ai Lam (1972–1990, UL94 Laika Buk 1–3)
1972 ning hta, UL gaw UL94-mungkan hta shawng ningnan lang na plastic wan n-gun hpe garan ginhka ai madang hpe shawng ningnan lang shapraw dat ai-dai gaw dai ni na aten na wan n-gun hpe garan ginhka ai ladat ni a npawt nhpang hpe gaw gap ya ai.
Core test nnan lahkawng hpe bai jat bang da sai: n-gup magap (HB) hte n-gup magap (vertical) wan hkru ai lam.
Shawng nnan na vertical model hpe V-0, V-1, hte V-2 ngu ai daw masum hku sha garan nna galaw ai. Madung jep joi ai lam ni gaw, ngam nga ai wan hkru ai aten ladaw hte, hka lim ai ntsin gaw cotton pad hpe wan hkru shangun ai kun ngu ai lam ni hpe jep joi ai lam ni rai nga ai.
Masum lang ngu na shapraw ai (1980) hta gaw, chyam dinglik ai ladat ni hpe grau nna gram lajang wa ai majaw, US Makawp Maga Dap kaw nna hkap la nna, electronic hte nta na arung arai ni a matu, hkan sa ra ai laika buk langai byin wa sai.
Shadawn sharam ai lam ni: N-gun ja ai, n-gun ja ai plastic ni hte sha htuk manu ai; n-gun n rawng ai n-gun rawng ai arung arai ni a matu laksan chyam dinglik ai lam n nga ai (ga shadawn, EVA, EPDM n-gun rawng ai arung arai, silicone n-gun rawng ai arung arai ni); n-gun n rawng ai arung arai ni a matu wan n-gun hpe ninghkap lu ai masat masa ni gaw, PCB a high-temperature stress-relief ra kadawn ai lam ni hpe hkap la lu na matu, madung hku nna grai kaba ai hte n hkum tsup ai.
III. Grade hku gram lajang ai lam: Ultra-hpyen n-gun (5V) hpe jat bang ai (1991–2012, Mali lang ngu na hte manga lang ngu na shapraw ai)
Mali lang ngu na (1991) hte manga lang ngu na (1996) hta, ahkyak ai gram lajang ai lam kaba lahkawng hpe shalawm wa nna, dai ni du hkra jai lang nga ai wan hkru ai lam hpe garan ginhka ai masa hpe gawgap da ai.
5VA hte 5VB wan n-gun hpe ninghkap lu ai masat masa ni hpe nnan jat bang ai (V-0 hta grau ai), n-gun ja ai nbung katsi ai hte kaba ai wan hpaw ai lam ni hpe shingdaw ai;
5VA: N--htu n-gun n rawng ai plate ni, IC substrate madang tsaw ai, n-gun n-gun n-rawng ai press ra ai lam ni, n-gun hpe shinggyin tawn ai arung arai ni a matu ra kadawn ai masat da ai lam ni hpe hkan sa ai.
5VB: Kachyi mi htu shangun ai; n-gun ja ai-n-gun rawng ai npawt nhpang daw langai mi.
EVA hte EPDM foam hte chyam dinglik ai lam hta n kaja ai lam ni hpe hparan na matu, thin films hte thin foam arung arai ni a matu laksan chyam dinglik ai lam ni hpe jat bang u.
Hpaga lam hta ahkyak ai masat dingsat langai: Electronic arung arai ni, PCB ni, n-gun atsam arung arai nnan ni hpe ya aten hta UL94 masat masa galaw ra ai, n-gun n law ai wan hkru ai HB-grade foam arung arai ni hpe gaw hpaga lam galaw shapraw ai lam kaw na loi loi hte shapraw kau nga ai.
Shawng daw na grup yin hte seng nna myit tsang ai lam ni: Europe mungdan ni gaw brominated wan n-gun shayawm ai tsi ni wan hkru ai shaloi byin pru wa ai dioxins ni hpe mu tam ai majaw, htunghking halogen-based wan n-gun shayawm ai EVA foam hpe pat hkum na matu shadut wa ai.
IV. Hkrang shapraw ai bai gram lajang ai lam: Mungkan ting chyam dinglik ai madang ni hpe kahkyin gumdin ai (6 lang ngu na shapraw ai, 2013)
UL94 a kru lang ngu na edition hpe 2013 ning hta shapraw ai rai nna, mungkan ting na maigan hpaga yumga garan gachyan ai lam ni hte maren sha rai na matu chyam dinglik hkam sharang ai lam ni hpe grai ngang kang hkra galaw ya ai.
Miwa, Amerikan, Uropa mungdan ni hta nga ai laboratory ni a lapran chyam dinglik ai lam hta n bung ai lam ni hpe yeng seng kau lu na matu, BenSheng pyengdin a wan n-ga tsaw ai, calorific value, sample dimensions, grup yin nbung katsi/hka n-gun ni hpe madang masat da na.
Wan hkru ai lam hpe n-gun n-gun n-rawng ai masa hta n-gun ja ai lam a akyu gaw asan sha rai nga ai: dai silicone foam langai sha a matu, V-0 ngu masat da ai 3 mm n-gun ja ai sample hpe foam layer gaw 0.5 mm sha n-gun ja ai rai yang V-1 de jahkrat kau mai ai.
Mungkan ting na ISO hte IEC wan hkru ai lam hpe ninghkap lu ai madang ni hpe hkan sa ai; EU hte Sinpraw Dingda Asia de dut shabra ai PCB lang ai arung arai ni hpe UL94 masat masa npu hta langai sha re ai masat masa galaw da ai.
Hkringmang daju a shingra tara tara ni hpe mung aten langai hta sha hkan sa wa sai: EU a RoHS matsun gaw polybrominated wan n-gun shayawm ai arung arai ni hpe pat hkum da ai majaw, ndai hpaga lam hpe halogen-n lawm ai V0 foam silicone hte phase-out halogen-wan n-gun shayawm ai EDM hte EPVA zawn re ai arung arai ni lawm ai de galai shai wa shangun ai.
V. Hpang jahtum na prat na madang ni:Hkringmang daju a grup yin hpe makawp maga na matu hte -hpyen n-gun kaba ai shara hta bungli galaw na matu ra kadawn ai lam lahkawng (7th Edition, 2023, ya aten hta akyu nga ai)
2023 ning hta shapraw ai 7 lang ngu na gaw mungkan ting hta madang masat da ai version rai nna, foam cushioning arung arai ni hte PCB thermal pressing application ni a matu grau kaja ai core jat ai lam ni hpe lawm ai.
Thin foam sponge ni a matu chye ginhka ai lam hpe grau nna gram lajang nna, shanhte a wan hkru ai atsam hpe hpaw da ai-cell silicone, hpaw da ai-cell EPDM, hte n-gun n rawng ai EVA ni hta garan ginhka ai.
200℃hta aten galu katsi ai shaloi, dai arai a wan n-gun n-gun hpe chyam dinglik ai lam hpe jat wa hkra galaw u: Dai arai a wan n-gun hpe n-gun n-gun hte n-gun n-jaw ai sha, grai hkra machyi ai lam n mai byin ai.
Ahkyak ai hpaga lam hta hkrum katut nga ai mayak mahkak ni hpe hparan ai: EVA hte htunghking EPDM wan n-gun shayawm ai tsi ni gaw -n-gun ja ai hka lim ai lam hpe madun dan ai; bai kahtap nna thermal compression galaw ai majaw V0 kaw nna HB de hkrat sum mat ai majaw PCB galaw shapraw ai line ni a matu n htap htuk mat ai.
Flame-retardant foam silicone gaw, n-gun ja ai-n-gun hpe hkam sharang lu ai hte V0 wan n-gun hpe n-gun n-jaw ai sha, phase garan ginhka ai lam n nga ai a majaw mying kaba ai, n-gun ja ai -n-gun hpe n-gun n-jaw ai sha, n-gun ja ai n-gun hpe n-gun n-jaw ai sha, jai lang na matu, madung lang ai arung arai tai wa sai.
Workshop wan hkru ai lam hta ra kadawn ai lam ni hte printed circuit board ni a matu san seng ai galaw shapraw ai madang ni hte maren, n-gun n law ai-wan n-gun hte n-gun n rawng ai wan hkru ai arung arai ni a matu masat masa nnan ni hpe shapraw da sai.
Mungkan ting na masa: Wan n-gun hpe shayawm lu ai masat masa ni gaw ya aten hta "wan hkrum ai shaloi tinang hkum tinang-hten kau lu ai" ngu ai hpe sha n-ga, kaga masat masa masum hpe mung lawm ai-katsi ai hpe hkam sharang lu ai atsam, halogen-n lawm ai grup yin hpe n-gun jaw lu ai, hka lim ai lam n nga ai.